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Daniel S. Green — 11 Patents

PSPseudolithic: 9 patents #1 of 7Top 15%
UIUniversity Of Illinois: 1 patents #1,280 of 3,009Top 45%
UFUS Air Force: 1 patents #6,232 of 16,312Top 40%
McLean, VA: #106 of 1,297 inventorsTop 9%
Virginia: #2,746 of 34,511 inventorsTop 8%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Daniel S. Green has been granted 11 US patents while listed as an inventor at Pseudolithic. The first was granted in 2017 and the most recent in June 2025. Daniel S. Green ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Daniel S. Green in McLean, VA, US.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12322714 Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault 2025-06-03
12261091 Chip integration into cavities of a host wafer using lateral dielectric material bonding Florian G. Herrault, Isaac Rivera, James F. Buckwalter 2025-03-25
12191295 Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditions James F. Buckwalter, Florian G. Herrault, Justin Kim, Michael D. Hodge 2025-01-07
12125759 Chip integration into cavities of a host wafer using lateral dielectric material bonding Florian G. Herrault, Isaac Rivera, James F. Buckwalter 2024-10-22
12099092 Built in self-test of heterogeneous integrated radio frequency chiplets James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault 2024-09-24
11940495 Built in self-test of heterogeneous integrated radio frequency chiplets James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault 2024-03-26
11810876 Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault 2023-11-07
11756848 Chip integration into cavities of a host wafer using lateral dielectric material bonding Florian G. Herrault, Isaac Rivera, James F. Buckwalter 2023-09-12
11733297 Built in self-test of heterogeneous integrated radio frequency chiplets James Buckwaiter, Michael D. Hodge, Justin Kim, Florian G. Herrault 2023-08-22
10262856 Selective oxidation of transition metal nitride layers within compound semiconductor device structures David J. Meyer, Brian P. Downey 2019-04-16
9837483 Nanoscale high-performance topological inductor Matthew J. Gilbert, Timothy Mathew Philip 2017-12-05

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11