Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261091 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2025-03-25 |
| 12125759 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2024-10-22 |
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2023-09-12 |