PC

Patty Chang-Chien

NG Northrop Grumman: 11 patents #475 of 2,250Top 25%
NS Northrop Grumman Space & Mission Systems: 2 patents #6 of 82Top 8%
University of Michigan: 1 patents #1,906 of 4,352Top 45%
📍 Redondo Beach, CA: #88 of 1,594 inventorsTop 6%
🗺 California: #43,449 of 386,348 inventorsTop 15%
Overall (All Time): #348,837 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
9960204 Waveguide and semiconductor packaging Chunbo Zhang, Peter Dinh-Tuan Ngo, Gershon Akerling, Kevin M. Leong, Kelly J. Hennig +1 more 2018-05-01
9774067 Low power threshold integrated micro-plasma limiter Benjamin Poust, Michael Battung, Dino Ferizovic 2017-09-26
9478458 Waveguide and semiconductor packaging Chunbo Zhang, Peter Dinh-Tuan Ngo, Gershon Akerling, Kevin M. Leong, Kelly J. Hennig +1 more 2016-10-25
9054500 Integrated micro-plasma limiter Kelly J. Hennig, Xianglin ZENG, Jeffrey Ming-Jer Yang 2015-06-09
8686813 Monolithically integrated active electronic circuit and waveguide structure for terahertz frequencies William R. Deal, Kevin Masaru Kung Hoong Leong, Vesna Radisic, Richard Lai 2014-04-01
8598465 Hermetic circuit ring for BCB WSA circuits David M. Eaves, Xiang-You Zeng, Kelly J. Hennig 2013-12-03
7919839 Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures Kelly Jill Tornquist Hennig 2011-04-05
7777318 Wafer level packaging integrated hydrogen getter Kelly Jill Tornquist Hennig, Xianglin ZENG, Jeffrey Ming-Jer Yang 2010-08-17
7696062 Method of batch integration of low dielectric substrates with MMICs Chi Kong Cheung, Melanie S. Yajima, Xianglin ZENG 2010-04-13
7662669 Method of exposing circuit lateral interconnect contacts by wafer saw Kelly Jill Tornquist Hennig, Ken Wai-Kin Ho, Ann Kent-Ming Ho 2010-02-16
7615863 Multi-dimensional wafer-level integrated antenna sensor micro packaging Jeffrey Ming-Jer Yang, Yun-Ho Chung 2009-11-10
7382213 Monolithically integrated switchable circuits with MEMS Jeffrey Ming-Jer Yang, Matt Nishimoto, Gregory H. Rowan, Kelly Tornquist 2008-06-03
7067397 Method of fabricating high yield wafer level packages integrating MMIC and MEMS components Kelly J. Tomquist, Craig GEIGER, Alvin M. Kong 2006-06-27
7004015 METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY, METHODS AND SYSTEMS FOR MONITORING AND CONTROLLING PRESSURE AND METHOD AND SYSTEM FOR TRIMMING RESONANT FREQUENCY OF A MICROSTRUCTURE THEREIN Kensall D. Wise 2006-02-28