Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D814541 | Robot | — | 2018-04-03 |
| 8741008 | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method | Masayuki Motonari, Eiichirou Kunitani, Tomikazu Ueno, Takashi Matsuda | 2014-06-03 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate | Noriyoshi Shimizu, Tomoo Yamasaki, Akio Rokugawa | 2008-04-01 |
| 7335531 | Semiconductor device package and method of production and semiconductor device of same | Akio Rokugawa | 2008-02-26 |
| 7314780 | Semiconductor package, method of production of same, and semiconductor device | Noriyoshi Shimizu, Akio Rokugawa | 2008-01-01 |
| 7250355 | Multilayered circuit substrate, semiconductor device and method of producing same | Akio Rokugawa | 2007-07-31 |
| 7033934 | Method of production of semiconductor package | Akio Rokugawa | 2006-04-25 |
| 7019404 | Multilayered circuit substrate, semiconductor device and method of producing same | Akio Rokugawa | 2006-03-28 |
| 6921977 | Semiconductor package, method of production of same, and semiconductor device | Noriyoshi Shimizu, Akio Rokugawa | 2005-07-26 |
| 6914322 | Semiconductor device package and method of production and semiconductor device of same | Akio Rokugawa | 2005-07-05 |
| 6891732 | Multilayer circuit board and semiconductor device using the same | Akihito Takano | 2005-05-10 |
| 6828669 | Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof | Shinichi Wakabayashi, Yuichi Matsuda | 2004-12-07 |
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Akio Rokugawa, Noriyoshi Shimizu | 2004-12-07 |
| D496019 | Mobile phone | Norio Okada, Sugiko Honda | 2004-09-14 |
| 6783652 | Process for manufacturing a wiring board | Akio Rokugawa, Yasuyoshi Horikawa | 2004-08-31 |
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Akio Rokugawa, Noriyoshi Shimizu | 2004-07-20 |
| D488791 | Mobile phone | Sugiko Honda, Norio Okada | 2004-04-20 |
| D487736 | Mobile phone | Norio Okada | 2004-03-23 |
| D487071 | Mobile phone | Mihoko Hotta, Takayuki Miyazawa | 2004-02-24 |
| D477581 | Mobile phone with a camera | Takayuki Miyazawa | 2003-07-22 |
| 6340841 | Build-up board package for semiconductor devices | Akio Rokugawa | 2002-01-22 |
| D436939 | Mobile phone | Katsumi Nagano, Kazutoshi Masunari | 2001-01-30 |
| 6180322 | Alkaline developing solution for radiation sensitive composition and development method | Kouichi Sakurai, Yukiko Ito, Hiroaki Nemoto | 2001-01-30 |
| D436090 | Mobile phone | Katsumi Nagano, Kazutoshi Masunari | 2001-01-09 |
| 6013415 | Radiation sensitive composition | Kouichi Sakurai, Yukiko Ito, Hiroaki Nemoto | 2000-01-11 |