Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5808359 | Semiconductor device having a heat sink with bumpers for protecting outer leads | Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike | 1998-09-15 |
| 5488254 | Plastic-molded-type semiconductor device | Asao Nishimura, Makoto Kitano | 1996-01-30 |
| 5194935 | Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +2 more | 1993-03-16 |
| 5150193 | Resin-encapsulated semiconductor device having a particular mounting structure | Toshihiro Yasuhara, Masachika Masuda, Gen Murakami, Kunihiko Nishi, Masanori Sakimoto +3 more | 1992-09-22 |
| 5121300 | Lead frame and electronic device employing the same | — | 1992-06-09 |
| 5047837 | Semiconductor device with heat transfer cap | Makoto Kitano, Takahiro Daikoku, Sueo Kawai, Kazuo Yamazaki, Asao Nishimura +2 more | 1991-09-10 |
| 5041901 | Lead frame and semiconductor device using the same | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Sueo Kawai, Akio Hoshi | 1991-08-20 |
| 4942452 | Lead frame and semiconductor device | Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi +5 more | 1990-07-17 |
| 4920074 | Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof | Akio Hoshi, Sumio Okada, Soichiro Nakamura | 1990-04-24 |
| 4907129 | Lead frame and electronic divice | — | 1990-03-06 |
| 4797787 | Lead frame and electronic device | — | 1989-01-10 |
| 4725692 | Electronic device and lead frame used thereon | Shigeru Ishii | 1988-02-16 |