Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037847 | Method of manufacturing semiconductor module and semiconductor module | Koji Bando | 2021-06-15 |
| 10811345 | Semiconductor device and method of manufacturing the same | Hideyuki Nishikawa | 2020-10-20 |
| 10573604 | Semiconductor device | Ryo Kanda | 2020-02-25 |
| 10566258 | Method of packaging power semiconductor module including power transistors | Koji Bando | 2020-02-18 |
| 10284109 | Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistors | Koji Bando, Hideaki Sato | 2019-05-07 |
| 10128200 | Semiconductor device | Ryo Kanda | 2018-11-13 |
| 9906165 | Semiconductor module | Koji Bando, Takamitsu Kanazawa, Ryo Kanda, Akihiro Tamura, Hirobumi MINEGISHI | 2018-02-27 |
| 7667307 | Semiconductor device | Toshiyuki Hata, Hiroshi Sato, Hiroi Oka, Osamu Ikeda | 2010-02-23 |
| 6492739 | Semiconductor device having bumper portions integral with a heat sink | Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2002-12-10 |
| 6392308 | Semiconductor device having bumper portions integral with a heat sink | Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2002-05-21 |
| 6320270 | Semiconductor device and method of producing the same | Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2001-11-20 |
| 6104085 | Semiconductor device and method of producing the same | Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2000-08-15 |
| 5808359 | Semiconductor device having a heat sink with bumpers for protecting outer leads | Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 1998-09-15 |