Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643930 | Semiconductor device with semiconductor chips of different sizes and manufacturing method threreof | Tadatoshi Danno, Hiroyuki Nakamura | 2020-05-05 |
| 10522446 | Semiconductor device and manufacturing method of the same | Tadatoshi Danno | 2019-12-31 |
| 10347567 | Semiconductor device and method of manufacturing the same | Yuichi Yato, Hiroi Oka, Tadatoshi Danno, Hiroyuki Nakamura | 2019-07-09 |
| 10157878 | Semiconductor device and electronic device | Tadatoshi Danno | 2018-12-18 |
| 10083898 | Manufacturing method of semiconductor device and semiconductor device | Tadatoshi Danno, Tsukasa Matsushita | 2018-09-25 |
| 10037932 | Semiconductor device and method of manufacturing the same | Yuichi Yato, Hiroi Oka, Tadatoshi Danno, Hiroyuki Nakamura | 2018-07-31 |
| 9837339 | Manufacturing method of semiconductor device and semiconductor device | Tadatoshi Danno, Tsukasa Matsushita | 2017-12-05 |
| 9735127 | Semiconductor device and electronic device | Tadatoshi Danno | 2017-08-15 |
| 9530721 | Semiconductor device | Tadatoshi Danno, Hiroyuki Nakamura, Osamu Soma, Akira Uemura | 2016-12-27 |
| 8994159 | Semiconductor device and manufacturing method thereof | Hiroyuki Nakamura, Akira Muto, Nobuya Koike, Yukihiro Sato, Katsuhiko Funatsu | 2015-03-31 |
| 8367479 | Semiconductor device and manufacturing method thereof | Hiroyuki Nakamura, Akira Muto, Nobuya Koike, Yukihiro Sato, Katsuhiko Funatsu | 2013-02-05 |
| 8338927 | Semiconductor device with the leads projected from sealing body | Hiroyuki Nakamura, Nobuya Koike | 2012-12-25 |
| 8298859 | Semiconductor connection component | Nobuya Koike, Tsukasa Matsushita, Hiroshi Sato, Keiichi Okawa | 2012-10-30 |
| 8026130 | Method for manufacturing a semiconductor integrated circuit device | Hiroyuki Nakamura, Nobuya Koike | 2011-09-27 |
| 7968370 | Semiconductor connection component | Nobuya Koike, Tsukasa Matsushita, Hiroshi Sato, Keiichi Okawa | 2011-06-28 |
| 7462887 | Semiconductor connection component | Nobuya Koike, Tsukasa Matsushita, Hiroshi Sato, Keiichi Okawa | 2008-12-09 |
| 6492739 | Semiconductor device having bumper portions integral with a heat sink | Kuniharu Muto, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2002-12-10 |
| 6392308 | Semiconductor device having bumper portions integral with a heat sink | Kuniharu Muto, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2002-05-21 |
| 6320270 | Semiconductor device and method of producing the same | Kuniharu Muto, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2001-11-20 |
| 6104085 | Semiconductor device and method of producing the same | Kuniharu Muto, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 2000-08-15 |
| 5808359 | Semiconductor device having a heat sink with bumpers for protecting outer leads | Kuniharu Muto, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu | 1998-09-15 |