Issued Patents All Time
Showing 26–50 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9568061 | Brake pad for yaw control, and brake member | Mika KOBUNE, Atsushi Fujita, Kouichi Ueda, Masayoshi Arakawa | 2017-02-14 |
| 9564790 | Method for manufacturing laminated core | Jin Oda | 2017-02-07 |
| 9548644 | Method of resin sealing permanent magnet and laminated core manufactured thereof | Go Kato, Yoshitada Yamagishi | 2017-01-17 |
| 9431314 | Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device | Tetsuya Enomoto, Emi MIYAZAWA, Kazutaka Honda, Keisuke Ookubo | 2016-08-30 |
| 9431883 | Method of manufacturing laminated core having permanent magnets sealed with resin | Satoshi Matsubayashi, Go Kato | 2016-08-30 |
| 9425120 | Semiconductor device and production method therefor | Kazutaka Honda, Makoto Satou | 2016-08-23 |
| 9387608 | Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition | Hayato Kotani, Naoyuki Urasaki, Kanako Yuasa, Mitsuyoshi Hamada | 2016-07-12 |
| 9318923 | Laminated iron core and method for manufacturing same | Jin Oda | 2016-04-19 |
| 9202622 | Welding transformer and welding transformer assembly and welding apparatus | Koji Kai, Kazuki Houzan, Kazuhiro Suzuki | 2015-12-01 |
| 8922084 | Rotor core | Go Kato | 2014-12-30 |
| 8916254 | Method for manufacturing laminated core and laminated core | Jin Oda, Tatsuhiko Mizutani, Yosuke Kurono | 2014-12-23 |
| 8615146 | Planar optical waveguide | Mitsuru Nagano, Akira Himeno, Masayuki Okuno, Masahiko Naito, Akihito Doi +1 more | 2013-12-24 |
| 8578592 | Method of manufacturing laminated rotor core | Mei Arazoe, Go Kato | 2013-11-12 |
| 8420210 | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof | Satoru Amou, Morimichi Umino, Yoshihiro Nakamura, Nobuyuki Minami | 2013-04-16 |
| 8273458 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima | 2012-09-25 |
| 8273457 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima | 2012-09-25 |
| 8252419 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima | 2012-08-28 |
| 8084130 | Epoxy resin molding material for sealing and electronic component device | Mitsuyoshi Hamada, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa | 2011-12-27 |
| 8044524 | Adhesive for connection of circuit member and semiconductor device using the same | — | 2011-10-25 |
| 8034659 | Production method of semiconductor device and bonding film | Masaaki Yasuda, Keiichi Hatakeyama, Tetsuya Enomoto | 2011-10-11 |
| 7928627 | Laminated core and method for manufacturing the same | Iwao Myojin, Akinori Hoshino, Masafumi Sakuma, Hiroyuki Yamamoto, Haruji Suzuki | 2011-04-19 |
| 7879445 | Adhesive for bonding circuit members, circuit board and process for its production | Itsuo Watanabe, Kenzo Takemura, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima | 2011-02-01 |
| 7847466 | Laminated core and method for manufacturing the same | Iwao Myojin | 2010-12-07 |
| 7777387 | Laminated core and method for manufacturing the same | Iwao Myojin, Akinori Hoshino, Masafumi Sakuma, Hiroyuki Yamamoto, Haruji Suzuki | 2010-08-17 |
| 7691473 | Fiber-reinforced composite material, method for manufacturing the same, and applications thereof | Hiroyuki Yano, Junji Sugiyama, Masaya Nogi, Shin-ichiro Iwamoto, Keishin Handa +7 more | 2010-04-06 |