TT

Tsuyoshi Takeda

HE Hitachi Kokusai Electric: 18 patents #32 of 843Top 4%
KE Kokusai Electric: 18 patents #19 of 583Top 4%
PA Panasonic: 11 patents #2,326 of 21,108Top 15%
SS Saginomiya Seisakusho: 8 patents #13 of 162Top 9%
TL Teijin Limited: 6 patents #186 of 1,631Top 15%
Nissan Motor Co.: 1 patents #4,519 of 8,689Top 55%
KO Konica: 1 patents #1,290 of 1,958Top 70%
MC Marubishi Oil Chemical Co.: 1 patents #8 of 22Top 40%
DY Dyflex: 1 patents #4 of 15Top 30%
SC Sodick Co.: 1 patents #79 of 172Top 50%
📍 Toyama, JP: #19 of 1,699 inventorsTop 2%
Overall (All Time): #33,586 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 51–65 of 65 patents

Patent #TitleCo-InventorsDate
9175151 Resin composition and method for producing circuit board Yuko Konno, Hiromitsu Takashita, Hiroaki Fujiwara, Shingo Yoshioka 2015-11-03
9111748 Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer readable recording medium Daigo YAMAGUCHI, Taketoshi Sato, Hidenari Yoshida 2015-08-18
9090969 Semiconductor device manufacturing and processing methods and apparatuses for forming a film Taketoshi Sato 2015-07-28
9082438 Three-dimensional structure for wiring formation Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita 2015-07-14
9082635 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Yuko Konno 2015-07-14
9082825 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device Hiromitsu Takashita, Keiko Kashihara, Hiroaki Fujiwara, Shingo Yoshioka 2015-07-14
9070393 Three-dimensional structure in which wiring is provided on its surface Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita 2015-06-30
9018340 Copolycarbonate and transparent molded article obtained therefrom Tetsuya Motoyoshi, Hiroshi Okamoto 2015-04-28
9012323 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium Arito OGAWA 2015-04-21
8951912 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium Arito OGAWA 2015-02-10
8929092 Circuit board, and semiconductor device having component mounted on circuit board Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita 2015-01-06
8877843 Resin composition and method for producing circuit board Yuko Konno, Hiromitsu Takashita, Hiroaki Fujiwara, Shingo Yoshioka 2014-11-04
8846546 Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and recording medium 2014-09-30
8816039 Copolycarbonate Tetsuya Motoyoshi, Masatoshi Ando 2014-08-26
6341200 Lens-fitted film unit Kazuhiro Nakanishi, Kunikazu Takano, Hiroshi Kibayashi, Hiromi Nakanishi, Tetsufumi Takaba +3 more 2002-01-22