Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7057265 | Semiconductor device and process for fabrication thereof | Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-06-06 |
| 7012320 | Semiconductor device and process for fabrication thereof | Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-03-14 |
| 6855579 | Semiconductor device and process for fabrication thereof | Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2005-02-15 |
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa +7 more | 2004-11-30 |
| 6754836 | Microcomputer capable of switching between low current consumption mode and normal operation mode | Yoshihiro Shimizu, Sachiko Kawaguchi | 2004-06-22 |
| 6743500 | Hollow carbon fiber and production method | Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai | 2004-06-01 |
| 6717242 | Semiconductor device and process for fabrication thereof | Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2004-04-06 |
| 6641792 | Hollow carbon fiber and production method | Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai | 2003-11-04 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi +7 more | 2000-08-08 |
| 6014318 | Resin-sealed type ball grid array IC package and manufacturing method thereof | — | 2000-01-11 |
| 5667899 | Electrically conductive bonding films | Masami Yusa, Takashi Masuko, Yasuo Miyadera, Mitsuo Yamazaki | 1997-09-16 |
| 5605763 | Electrically conductive bonding films | Masami Yusa, Takashi Masuko, Yasuo Miyadera, Mitsuo Yamazaki | 1997-02-25 |
| 5401878 | Fluorine-containing polyimides and precursors thereof | Masami Yusa, Yasuo Miyadera | 1995-03-28 |
| 5270438 | Fluorine-containing polyimides and precursors thereof | Masami Yusa, Yasuo Miyadera | 1993-12-14 |
| 5243019 | Alkenyl-fluorine-containing aromatic polyamide | Masami Yusa, Yasuo Miyadera | 1993-09-07 |
| 5042871 | Glass pane for use in a vehicle | Terutsugu Gotanda, Isao Fugawa, Keiichi Kano, Hideo Yano, Tatuo Shimada | 1991-08-27 |
| 4960262 | Ball valve and methods of fabrication | Mitsuharu Hashimoto | 1990-10-02 |
| 4883253 | Ball valve and methods of fabrication | Mitsuharu Hashimoto | 1989-11-28 |
| 4869450 | Ball valve | Mitsuharu Hashimoto | 1989-09-26 |
| 4813649 | Ball valve | Mitsuharu Hashimoto | 1989-03-21 |
| 4737090 | Movable vane compressor | Takuo Sakai, Masato Yokoyama, Eiichi Nagasaku, Makoto Kondo | 1988-04-12 |
| 4667926 | Ball valve | Teruyoshi Asano, Yoshiaki Bando | 1987-05-26 |
| 4579755 | Longitudinal molding with nonuniform sections | Nobutoshi Hase | 1986-04-01 |
| 4489019 | Method for producing a longitudinal molding with nonuniform sections | Nobutoshi Hase | 1984-12-18 |
| 4450038 | Hot air blast welding apparatus for thermoplastic parts | Masami Ishii, Hitoshi Sugimoto, Susumu Shibata | 1984-05-22 |