KC

Kin P. Cheung

UC US Dept of Commerce: 4 patents #62 of 1,030Top 7%
AG Agere Systems Guardian: 2 patents #139 of 810Top 20%
AT AT&T: 2 patents #7,280 of 18,772Top 40%
RJ Rutgers, The State University Of New Jersey: 1 patents #651 of 1,498Top 45%
RU Rutgers University: 1 patents #54 of 194Top 30%
SE Sematech: 1 patents #38 of 123Top 35%
PS Penn State: 1 patents #667 of 1,788Top 40%
AS Agere Systems: 1 patents #984 of 1,849Top 55%
NT National Institute Of Standards And Technology: 1 patents #8 of 107Top 8%
📍 Rockville, MD: #194 of 2,038 inventorsTop 10%
🗺 Maryland: #2,486 of 35,612 inventorsTop 7%
Overall (All Time): #409,447 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11507135 Molecular scrivener for reading or writing data to a macromolecule Joseph W. Robertson, John J. Kasianowicz 2022-11-22
11294075 Non-resonant electron spin resonant probe and associated hardware Jason Campbell, Jason Ryan, Marc Frederic Desrosiers, Robert M. Gougelet, Pragya Shrestha 2022-04-05
10247814 Phase shift detector process for making and use of same Jason Ryan, Jason Campbell 2019-04-02
10241149 Massively parallel wafer-level reliability system and process for massively parallel wafer-level reliability testing 2019-03-26
9507004 Electron spin resonance spectrometer and method for using same Jason Campbell, Jason Ryan, Patrick M. Lenahan 2016-11-29
7548067 Methods for measuring capacitance Dawei Heh, Byoung Hun Lee, Rino Choi 2009-06-16
6936494 Processes for hermetically packaging wafer level microscopic structures 2005-08-30
6524872 Using fast hot-carrier aging method for measuring plasma charging damage 2003-02-25
6469390 Device comprising thermally stable, low dielectric constant material Chorng-Ping Chang, Chien-Shing Pai, Wei Zhu 2002-10-22
6365426 Method of determining the impact of plasma-charging damage on yield and reliability in submicron integrated circuits Philip W. Mason 2002-04-02
5908312 Semiconductor device fabrication Steven J. Hillenius, Chun-Ting Liu, Yi Ma, Pradip K. Roy 1999-06-01
5008217 Process for fabricating integrated circuits having shallow junctions Christopher J. Case, Ruichen Liu, Ronald J. Schutz, Richard S. Wagner, II 1991-04-16