Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10193012 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2019-01-29 |
| 10181546 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | Manen Lu, Zhe Wang | 2019-01-15 |
| 10177016 | Pre-screening method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2019-01-08 |
| 10170665 | Repairing method, manufacturing method, device and electronics apparatus of micro-LED | Zhe Wang | 2019-01-01 |
| 10163869 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2018-12-25 |
| 10141287 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2018-11-27 |
| 10057689 | Silicon speaker | — | 2018-08-21 |
| 10050180 | LED with stress-buffer layer under metallization layer | Salman Akram | 2018-08-14 |
| 10020293 | Transferring method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2018-07-10 |
| 10020420 | Repairing method, manufacturing method, device and electronic apparatus of micro-LED | Zhe Wang | 2018-07-10 |
| 9930453 | Silicon microphone with high-aspect-ratio corrugated diaphragm and a package with the same | Zhe Wang | 2018-03-27 |
| 9908775 | Transfer method, manufacturing method, device and electronic apparatus of MEMS | Zhe Wang | 2018-03-06 |
| 9866971 | Method for manufacturing thermal bimorph diaphragm and MEMS speaker with thermal bimorphs | Zhe Wang, Jifang Tao, Guanxun Qiu | 2018-01-09 |
| 9640729 | LED with stress-buffer layer under metallization layer | Salman Akram | 2017-05-02 |
| 9343612 | Method of bonding a semiconductor device to a support substrate | Salman Akram, Jerome Chanra Bhat | 2016-05-17 |
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Uppili Sridhar, Amit S. Kelkar, Xuejun Ying | 2016-05-03 |
| 8970043 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Uppili Sridhar, Amit S. Kelkar, Xuejun Ying | 2015-03-03 |
| 7463125 | Microrelays and microrelay fabrication and operating methods | Uppili Sridhar | 2008-12-09 |
| 7393758 | Wafer level packaging process | Uppili Sridhar | 2008-07-01 |
| 6858459 | Method of fabricating micro-mirror switching device | Janak Singh, Uppili Sridhar, Ranganathan Nagarajan | 2005-02-22 |
| 6841839 | Microrelays and microrelay fabrication and operating methods | Uppili Sridhar | 2005-01-11 |
| 6762049 | Miniaturized multi-chamber thermal cycler for independent thermal multiplexing | Uppili Sridhar | 2004-07-13 |
| 6716661 | Process to fabricate an integrated micro-fluidic system on a single wafer | Yu Chen, Janak Singh, Tit Meng Lim, Tie Yan, Chew Kiat Heng | 2004-04-06 |
| 6621135 | Microrelays and microrelay fabrication and operating methods | Uppili Sridhar | 2003-09-16 |
| 6521447 | Miniaturized thermal cycler | Uppili Sridhar, Yu Chen, Tit Meng Lim, Emmanuel Selvanayagam Zachariah, Tie Yan | 2003-02-18 |