Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600333 | Method and test structure for characterizing sidewall damage in a semiconductor device | Jeremy I. Martin, Nicholas J. Kepler | 2003-07-29 |
| 6429128 | Method of forming nitride capped Cu lines with reduced electromigration along the Cu/nitride interface | Paul R. Besser, Minh Van Ngo | 2002-08-06 |
| 6261963 | Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices | Paul R. Besser, Eric M. Apelgren, Christian Zistl, Jonathan B. Smith | 2001-07-17 |