Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath +2 more | 2019-01-22 |
| 8765512 | Packaging compatible wafer level capping of MEMS devices | Paul A. Kohl, Rajarshi Saha | 2014-07-01 |