Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6706205 | Semiconductor processing article | Udo Heinz Retzlaff, Stephan Popp | 2004-03-16 |
| 6706624 | Method for making multichip module substrates by encapsulating electrical conductors | Christopher James Kapusta | 2004-03-16 |
| 6602739 | Method for making multichip module substrates by encapsulating electrical conductors and filling gaps | James Wilson Rose, Christopher James Kapusta, Ernest Wayne Balch, Kevin Matthew Durocher | 2003-08-05 |
| 6548189 | Epoxy adhesive | Somasundaram Gunasekaran, Herbert S. Cole, Jr. | 2003-04-15 |
| 6533968 | Structure and method for molding optical disks | Thomas Feist | 2003-03-18 |
| 6508961 | Structure and method for molding optical disks | Thomas Feist | 2003-01-21 |
| 6504233 | Semiconductor processing component | Margaret Ellen Lazzeri, Frederic F. Ahlgren | 2003-01-07 |
| 6396153 | Circuit chip package and fabrication method | Raymond Albert Fillion, Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski +1 more | 2002-05-28 |
| 6368410 | Semiconductor processing article | Udo Heinz Retzlaff, Stephan Popp | 2002-04-09 |
| 6302987 | High voltage polymer processing methods and power feed-through bushing applications | Robert J. Wojnarowski, Clive W. Reed | 2001-10-16 |
| 6303193 | Process for fabricating a tool used in electrochemical machining | Renato Guida, Kevin Matthew Durocher, Bin Wei | 2001-10-16 |
| 6284564 | HDI chip attachment method for reduced processing | Ernest Wayne Balch, Leonard Richard Douglas | 2001-09-04 |
| 6255137 | Method for making air pockets in an HDI context | Herbert S. Cole, Jr. | 2001-07-03 |
| 6242282 | Circuit chip package and fabrication method | Raymond Albert Fillion, Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski +1 more | 2001-06-05 |
| 6146558 | Structure and method for molding optical disks | Thomas Feist, Richard Joseph Saia, Paul Alan McConnelee | 2000-11-14 |
| 6067931 | Thermal processor for semiconductor wafers | Mario Ghezzo, Timothy D. Page, Rolf S. Bergman, Himanshu B. Vakil, Charles Samuel Huey +1 more | 2000-05-30 |
| 5757072 | Structure for protecting air bridges on semiconductor chips from damage | Bernard Gorowitz, Charles Becker, Renato Guida, James Wilson Rose | 1998-05-26 |
| 5703400 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Robert J. Wojnarowski | 1997-12-30 |
| 5567657 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Robert J. Wojnarowski | 1996-10-22 |
| 5561085 | Structure for protecting air bridges on semiconductor chips from damage | Bernard Gorowitz, Charles Becker, Renato Guida, James Wilson Rose | 1996-10-01 |
| 5546654 | Vacuum fixture and method for fabricating electronic assemblies | Robert J. Wojnarowski | 1996-08-20 |
| 5492586 | Method for fabricating encased molded multi-chip module substrate | — | 1996-02-20 |
| 5472539 | Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components | Richard Joseph Saia, Kevin Matthew Durocher, Mario Ghezzo | 1995-12-05 |
| 5302547 | Systems for patterning dielectrics by laser ablation | Robert J. Wojnarowski, Herbert S. Cole, Jr., Richard Joseph Saia, Ernest Wayne Balch | 1994-04-12 |
| 5300812 | Plasticized polyetherimide adhesive composition and usage | John H. Lupinski, Theresa A. Sitnik, Steven Thomas Rice, Herbert S. Cole, Jr. | 1994-04-05 |