KD

Kevin Matthew Durocher

GE: 59 patents #173 of 36,430Top 1%
LM Lockheed Martin: 3 patents #1,088 of 6,507Top 20%
UF US Air Force: 1 patents #6,190 of 16,312Top 40%
📍 Cohoes, NY: #5 of 185 inventorsTop 3%
🗺 New York: #1,250 of 115,490 inventorsTop 2%
Overall (All Time): #34,904 of 4,157,543Top 1%
64
Patents All Time

Issued Patents All Time

Showing 26–50 of 64 patents

Patent #TitleCo-InventorsDate
7956457 System and apparatus for venting electronic packages and method of making same Raymond Albert Fillion, Elizabeth Ann Burke, Thomas Bert Gorczyca, Charles G. Woychik 2011-06-07
7952187 System and method of forming a wafer scale package Christopher James Kapusta, Donald Paul Cunningham, Richard Joseph Saia, Joseph Alfred Iannotti, William Hawkins 2011-05-31
7952196 Affordable high performance high frequency multichip module fabrication and apparatus Joseph Alfred Iannotti, Christopher James Kapusta 2011-05-31
7919714 System and a method for controlling flow of solder Arun Virupaksha Gowda, James Wilson Rose, Paul Jeffrey Gillespie, Richard Alfred Beaupre, David Richard Esler 2011-04-05
7791252 Ultrasound probe assembly and method of fabrication Charles Edward Baumgartner, Robert Stephen Lewandowski, David A. Chartrand 2010-09-07
7781238 Methods of making and using integrated and testable sensor array Robert Gideon Wodnicki, Stacey Joy Kennerly, Wei-Cheng Tian, David Martin Mills, Charles G. Woychik +1 more 2010-08-24
7727808 Ultra thin die electronic package Christopher James Kapusta, Joseph Alfred Iannotti 2010-06-01
7517785 Electronic interconnects and methods of making same James Wilson Rose 2009-04-14
7427566 Method of making an electronic device cooling system Stacey Goodwin, Ernest Wayne Balch, Christopher James Kapusta 2008-09-23
7158383 Techniques for fabricating a resistor on a flexible base material Richard Joseph Saia, Vikram Krishnamurthy 2007-01-02
6994897 Method of processing high-resolution flex circuits with low distortion Christopher James Kapusta, Mehmet Arik, Richard Joseph Saia, Piet Moeleker 2006-02-07
6933813 Interconnection structure with etch stop William Edward Burdick, Jr., James Wilson Rose, Raymond Albert Fillion 2005-08-23
6790703 Apparatus for aligning die to interconnect metal on flex substrate Richard Joseph Saia, James Wilson Rose, Leonard Richard Douglas 2004-09-14
6773962 Microelectromechanical system device packaging method Richard Joseph Saia, Christopher James Kapusta, Matthew Christian Nielsen 2004-08-10
6767764 Microelectromechanical system device packaging method Richard Joseph Saia, Christopher James Kapusta, Matthew Christian Nielsen 2004-07-27
6733711 Plastic packaging of LED arrays Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Herbert S. Cole, Jr., Ronald Frank Kolc 2004-05-11
6730533 Plastic packaging of LED arrays Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Herbert S. Cole, Jr., Ronald Frank Kolc 2004-05-04
6709944 Techniques for fabricating a resistor on a flexible base material Richard Joseph Saia, Vikram Krishnamurthy 2004-03-23
6671948 Interconnection method using an etch stop William Edward Burdick, Jr., James Wilson Rose, Raymond Albert Fillion 2004-01-06
6614103 Plastic packaging of LED arrays Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Herbert S. Cole, Jr., Ronald Frank Kolc 2003-09-02
6602739 Method for making multichip module substrates by encapsulating electrical conductors and filling gaps James Wilson Rose, Thomas Bert Gorczyca, Christopher James Kapusta, Ernest Wayne Balch 2003-08-05
6548329 Amorphous hydrogenated carbon hermetic structure fabrication method Richard Joseph Saia, James Wilson Rose 2003-04-15
6475877 Method for aligning die to interconnect metal on flex substrate Richard Joseph Saia, James Wilson Rose, Leonard Richard Douglas 2002-11-05
6429381 High density interconnect multichip module stack and fabrication method Richard Joseph Saia, Robert J. Wojnarowski, Stanton Earl Weaver, Christopher James Kapusta, James Sabatini 2002-08-06
6323096 Method for fabricating a flexible interconnect film with resistor and capacitor layers Richard Joseph Saia, Herbert S. Cole, Jr. 2001-11-27