Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837438 | GaN transistors with polysilicon layers used for creating additional components | Jianjun Cao, Robert Beach, Alexander Lidow, Alana Nakata, Guangyuan Zhao +8 more | 2017-12-05 |
| 9817198 | Optical module | Shiquan Yang, Xianpeng Du, Hao Wang, Hongwei Mu | 2017-11-14 |
| 9642385 | Microwave sterilization or pasteurization | Juming Tang | 2017-05-09 |
| 9583480 | Integrated circuit with matching threshold voltages and method for making same | Jianjun Cao, Robert Beach, Alexander Lidow, Alana Nakata, Robert Strittmatter +7 more | 2017-02-28 |
| 9477529 | Job distributed within a grid environment using mega-host groupings of execution hosts based on resource attributes | Chong Chen, Qi Wang, Shutao Yuan | 2016-10-25 |
| 9331191 | GaN device with reduced output capacitance and process for making same | Stephen L. Colino, Jianjun Cao, Robert Beach, Alexander Lidow, Alana Nakata +9 more | 2016-05-03 |
| 9214399 | Integrated circuit with matching threshold voltages and method for making same | Jianjun Cao, Robert Beach, Alexander Lidow, Alana Nakata, Robert Strittmatter +7 more | 2015-12-15 |
| 9214461 | GaN transistors with polysilicon layers for creating additional components | Jianjun Cao, Robert Beach, Alexander Lidow, Alana Nakata, Guangyuan Zhao +8 more | 2015-12-15 |
| 9214528 | Method to fabricate self-aligned isolation in gallium nitride devices and integrated circuits | Chunhua Zhou, Jianjun Cao, Alexander Lidow, Robert Beach, Alana Nakata +6 more | 2015-12-15 |
| 9171911 | Isolation structure in gallium nitride devices and integrated circuits | Chunhua Zhou, Jianjun Cao, Alexander Lidow, Robert Beach, Alana Nakata +6 more | 2015-10-27 |
| 8981270 | Method for recording temperature profiles in food packages during microwave heating using a metallic data logger | Juming Tang | 2015-03-17 |
| 8823012 | Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same | Alexander Lidow, Robert Beach, Alana Nakata, Jianjun Cao, Guang Yuan Zhao +1 more | 2014-09-02 |
| 8361898 | Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof | Kai Wang | 2013-01-29 |
| 7833810 | Method of fabricating isolation structures for CMOS image sensor chip scale packages | Tzu-Han Lin, Tzy-Ying Lin, Kai Wang | 2010-11-16 |
| 7824964 | Method for fabricating package structures for optoelectronic devices | Kai Wang | 2010-11-02 |
| 7791661 | Circuits and methods for image signal sampling | Wei Feng, Wenge Hu, Jingjun Fu, Hui Zhao | 2010-09-07 |
| 7679187 | Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof | Kai Wang | 2010-03-16 |
| 7569409 | Isolation structures for CMOS image sensor chip scale packages | Tzu-Han Lin, Tzy-Ying Lin, Kai Wang | 2009-08-04 |
| 7566944 | Package structure for optoelectronic device and fabrication method thereof | Kai Wang | 2009-07-28 |
| 7119313 | Apparatus and method for heating objects with microwaves | Juming Tang, Surya Kumar Pathak, Eugene E. Eves, II | 2006-10-10 |
| 6194288 | Implant N2 into a pad oxide film to mask the active region and grow field oxide without Si3N4 film | Fu-Jier Fahn | 2001-02-27 |