SB

Suryadevara V. Babu

Eastman Kodak: 9 patents #1,246 of 8,114Top 20%
IBM: 8 patents #13,150 of 70,183Top 20%
CU Clarkson University: 6 patents #2 of 137Top 2%
FE Ferro: 4 patents #60 of 431Top 15%
IC Infotonics Technology Center: 2 patents #2 of 8Top 25%
RO Rhodia Operations: 2 patents #227 of 707Top 35%
PO Ppg Industries Ohio: 1 patents #741 of 1,316Top 60%
SE Sematech: 1 patents #38 of 123Top 35%
TI Teledyne Industries: 1 patents #209 of 517Top 45%
CM Climax Engineered Materials: 1 patents #15 of 28Top 55%
📍 Potsdam, NY: #8 of 231 inventorsTop 4%
🗺 New York: #3,998 of 115,490 inventorsTop 4%
Overall (All Time): #123,501 of 4,157,543Top 3%
30
Patents All Time

Issued Patents All Time

Showing 26–30 of 30 patents

Patent #TitleCo-InventorsDate
4810326 Interlaminate adhesion between polymeric materials and electrolytic copper surfaces Vu Q. Bui, Joseph G. Hoffarth, John A. Welsh 1989-03-07
4735820 Removal of residual catalyst from a dielectric substrate Peter A. Agostino, Joseph G. Hoffarth 1988-04-05
4718972 Method of removing seed particles from circuit board substrate surface William F. Herrmann, Joseph G. Hoffarth, Voya R. Markovich, Robert T. Wiley 1988-01-12
4618477 Uniform plasma for drill smear removal reactor Ronald S. Horwath, Neng-Hsing Lu, John A. Welsh 1986-10-21
4599134 Plasma etching with tracer Joseph G. Hoffarth, John A. Welsh 1986-07-08