Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043421 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-22 |
| 11037813 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-15 |
| 11037814 | Wafer processing method using a ring frame with a polyester sheet with no adhesive layer | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-15 |
| 11031234 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-08 |
| 11024543 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-06-01 |
| 11018043 | Wafer processing method using a ring frame and a polyester sheet | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-05-25 |
| 11018058 | Wafer processing method for dividing a wafer along predefined division lines using polyester sheet | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-05-25 |
| 11011407 | Wafer processing method using a ring frame and a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-05-18 |
| 11004744 | Wafer processing method for dividing a wafer along predefined division lines | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-05-11 |
| 10998232 | Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-05-04 |
| 10991624 | Wafer processing method including applying a polyolefin sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-04-27 |
| 10991587 | Wafer processing method including applying a polyester sheet to a wafer | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-04-27 |
| 10985067 | Wafer processing method using a laser beam dividing step | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-04-20 |
| 10985066 | Wafer processing method for dividing a wafer along division lines | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-04-20 |
| 10933618 | Carrier plate removing method | Katsuhiko Suzuki, Takatoshi Sakurai | 2021-03-02 |
| 10933500 | Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatus | Hajime Kameda | 2021-03-02 |
| 10910269 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-02-02 |
| 10896850 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2021-01-19 |
| 10847420 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2020-11-24 |
| 10804131 | Carrier plate removing method | Katsuhiko Suzuki | 2020-10-13 |
| 10720355 | Wafer processing method | Shigenori Harada, Minoru Matsuzawa, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari +4 more | 2020-07-21 |
| 10071433 | Flange mechanism and cutting apparatus | Toshifumi Matsuyama, Hiromitsu Ueyama, Koji Nanbu | 2018-09-11 |
| 9431299 | Package substrate dividing method | Shigeya Kurimura | 2016-08-30 |
| 8815732 | Wire bonding method and semiconductor device | Tatsunari Mii, Shinsuke Tei | 2014-08-26 |
| 8232656 | Semiconductor device | Tatsunari Mii, Shinsuke Tei | 2012-07-31 |