Chun-Yu Kao — 8 Patents at Co-Tech Development

Chun-Yu Kao has been granted 8 US patents while listed as an inventor at Co-Tech Development. The first was granted in 2021 and the most recent in April 2025. Chun-Yu Kao ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Chun-Yu Kao in Hsinchu, TW.

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12266529	Patterning semiconductor devices and structures resulting therefrom	Sung-En Lin, Chia-Cheng Chao	2025-04-01
12120816	Micro-roughened electrodeposited copper foil and copper clad laminate	Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu	2024-10-15
11848209	Patterning semiconductor devices and structures resulting therefrom	Sung-En Lin, Chia-Cheng Chao	2023-12-19	$9,903,000
11655555	Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu	2023-05-23
11408087	Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu	2022-08-09
11332839	Advanced electrodeposited copper foil and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu	2022-05-17
11053602	Micro-roughened electrodeposited copper foil and copper foil substrate	Yun-Hsing Sung	2021-07-06
11047061	Micro-roughened electrodeposited copper foil and copper foil substrate	Yun-Hsing Sung, Zong-Xian Wu	2021-06-29

Chun-Yu Kao — 8 Patents

Patents per Year

Issued Patents All Time

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