Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266529 | Patterning semiconductor devices and structures resulting therefrom | Sung-En Lin, Chia-Cheng Chao | 2025-04-01 |
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu | 2024-10-15 |
| 11848209 | Patterning semiconductor devices and structures resulting therefrom | Sung-En Lin, Chia-Cheng Chao | 2023-12-19 |
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu | 2023-05-23 |
| 11408087 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu | 2022-08-09 |
| 11332839 | Advanced electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu | 2022-05-17 |
| 11053602 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung | 2021-07-06 |
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Yun-Hsing Sung, Zong-Xian Wu | 2021-06-29 |