Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2024-10-15 |
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2023-05-23 |
| 11408087 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2022-08-09 |
| 11332839 | Advanced electrodeposited copper foil and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2022-05-17 |
| 11186918 | Micro-roughened electrodeposited copper foil and copper clad laminate using the same | — | 2021-11-30 |
| 11053602 | Micro-roughened electrodeposited copper foil and copper foil substrate | Chun-Yu Kao | 2021-07-06 |
| 11047061 | Micro-roughened electrodeposited copper foil and copper foil substrate | Chun-Yu Kao, Zong-Xian Wu | 2021-06-29 |