Hung-Wei Hsu — 9 Patents at Apple

Hung-Wei Hsu has been granted 9 US patents while listed as an inventor at Apple. The first was granted in 2016 and the most recent in October 2024. Hung-Wei Hsu ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Hung-Wei Hsu in Taipei, TW.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date
12120816	Micro-roughened electrodeposited copper foil and copper clad laminate	Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao	2024-10-15
11655555	Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao	2023-05-23
11408087	Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao	2022-08-09
11332839	Advanced electrodeposited copper foil and copper clad laminate using the same	Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao	2022-05-17
10074941	High-speed connector and connector assembly	Hou-An Su, Chang-Fa Yang, Xiao Liao, Mei-Jie Zhou	2018-09-11
9774143	High frequency signal communication connector with improved crosstalk performance	Hou-An Su, Chi-Jung Chan, Ray-Cheh Wu	2017-09-26
9634432	High frequency connector with enhanced grounding for reduced crosstalk	Hou-An Su, Chi-Jung Chan	2017-04-25
9520678	Signal transmission connector	Hou-An Su, Chang-Fa Yang, Huai-Sheng Wang	2016-12-13
9323016	Bi-directional data transmission method, high-frequency connector and optical connector using the same	Hou-An Su, Chi-Jung Chan	2016-04-26

Hung-Wei Hsu — 9 Patents

Issued Patents All Time

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