HH

Hung-Wei Hsu

Apple: 5 patents #5,407 of 18,612Top 30%
CD Co-Tech Development: 4 patents #4 of 20Top 20%
Overall (All Time): #548,733 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12120816 Micro-roughened electrodeposited copper foil and copper clad laminate Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2024-10-15
11655555 Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2023-05-23
11408087 Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2022-08-09
11332839 Advanced electrodeposited copper foil and copper clad laminate using the same Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao 2022-05-17
10074941 High-speed connector and connector assembly Hou-An Su, Chang-Fa Yang, Xiao Liao, Mei-Jie Zhou 2018-09-11
9774143 High frequency signal communication connector with improved crosstalk performance Hou-An Su, Chi-Jung Chan, Ray-Cheh Wu 2017-09-26
9634432 High frequency connector with enhanced grounding for reduced crosstalk Hou-An Su, Chi-Jung Chan 2017-04-25
9520678 Signal transmission connector Hou-An Su, Chang-Fa Yang, Huai-Sheng Wang 2016-12-13
9323016 Bi-directional data transmission method, high-frequency connector and optical connector using the same Hou-An Su, Chi-Jung Chan 2016-04-26