Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao | 2024-10-15 |
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao | 2023-05-23 |
| 11408087 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao | 2022-08-09 |
| 11332839 | Advanced electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Chun-Yu Kao | 2022-05-17 |
| 10074941 | High-speed connector and connector assembly | Hou-An Su, Chang-Fa Yang, Xiao Liao, Mei-Jie Zhou | 2018-09-11 |
| 9774143 | High frequency signal communication connector with improved crosstalk performance | Hou-An Su, Chi-Jung Chan, Ray-Cheh Wu | 2017-09-26 |
| 9634432 | High frequency connector with enhanced grounding for reduced crosstalk | Hou-An Su, Chi-Jung Chan | 2017-04-25 |
| 9520678 | Signal transmission connector | Hou-An Su, Chang-Fa Yang, Huai-Sheng Wang | 2016-12-13 |
| 9323016 | Bi-directional data transmission method, high-frequency connector and optical connector using the same | Hou-An Su, Chi-Jung Chan | 2016-04-26 |