Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Advanced electrodeposited copper foil and copper clad laminate using the same

Advanced electrodeposited copper foil and copper clad laminate using the same

US Patent 11332839 · Granted May 17, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Patterning semiconductor devices and structures resulting therefrom2025
Micro-roughened electrodeposited copper foil and copper clad laminate2024
Micro-roughened electrodeposited copper foil and copper clad laminate2024
Micro-roughened electrodeposited copper foil and copper clad laminate2024
Micro-roughened electrodeposited copper foil and copper clad laminate2024
Patterning semiconductor devices and structures resulting therefrom2023
Advanced reverse treated electrodeposited copper foil and copper clad laminate u2023
Advanced reverse treated electrodeposited copper foil and copper clad laminate u2023
Advanced reverse treated electrodeposited copper foil and copper clad laminate u2023
Advanced reverse treated electrodeposited copper foil and copper clad laminate u2023
Advanced electrodeposited copper foil having island-shaped microstructures and c2022
Advanced electrodeposited copper foil having island-shaped microstructures and c2022