Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120816 | Micro-roughened electrodeposited copper foil and copper clad laminate | Yun-Hsing Sung, Hung-Wei Hsu, Chun-Yu Kao | 2024-10-15 |
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Hung-Wei Hsu, Chun-Yu Kao | 2023-05-23 |
| 11408087 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Yun-Hsing Sung, Hung-Wei Hsu, Chun-Yu Kao | 2022-08-09 |
| 11332839 | Advanced electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Hung-Wei Hsu, Chun-Yu Kao | 2022-05-17 |