Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349635 | Integrated circuits and methods of forming the same with multi-level electrical connection | Huang Liu | 2016-05-24 |
| 7524755 | Entire encapsulation of Cu interconnects using self-aligned CuSiN film | Johnny Widodo, Bei Chao Zhang, Tong Qing Chen, Yong Kong Siew, Fan Zhang +2 more | 2009-04-28 |
| 7294241 | Method to form alpha phase Ta and its application to IC manufacturing | Chim Seng Seet, Bei Chao Zhang, John Sudijono, Lai Lin Clare Yong | 2007-11-13 |