Issued Patents All Time
Showing 76–92 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7155914 | Cooling structure for electronic equipment | Minoru Ishinabe, Hideshi Tokuhira, Hiroaki Date, Wataru Tanaka | 2007-01-02 |
| 7121775 | Portable electric tool | Akira Onose | 2006-10-17 |
| D511079 | Portable electric router | Takashi Ozawa, Masato Sakai, Takeshi Taniguchi, Akira Onose | 2005-11-01 |
| 6867378 | Solder paste and terminal-to-terminal connection structure | Masayuki Ochiai | 2005-03-15 |
| 6662345 | Method and apparatus for designing printed-circuit board | Yasuo Yamagishi | 2003-12-09 |
| 6596094 | Solder paste and electronic device | Masayuki Ochiai, Yasuo Yamagishi, Masayuki Kitajima, Masakazu Takesue, Tadaaki Shono | 2003-07-22 |
| 6461953 | Solder bump forming method, electronic component mounting method, and electronic component mounting structure | Seiki Sakuyama | 2002-10-08 |
| 6275750 | Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace | Seiki Sakuyama | 2001-08-14 |
| 5910340 | Electroless nickel plating solution and method | Masayuki Kiso, Takayuki Nakamura, Tohru Kamitamari, Rumiko Susuki, Koichiro Shimizu | 1999-06-08 |
| 5872699 | Electronic apparatus, housing for electronic apparatus and housing manufacturing method | Kota Nishii, Kouichi Kimura, Masanobu Ishizuki, Katsura Adachi | 1999-02-16 |
| 5770835 | Process and apparatus and panel heater for soldering electronic components to printed circuit board | Seiki Sakuyama, Isao Watanabe | 1998-06-23 |
| 5607609 | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering | Seiki Sakuyama, Isao Watanabe | 1997-03-04 |
| 5294554 | Analysis of tin, lead or tin-lead alloy plating solution | Motonobu Kubo, Masayuki Kiso, Teruyuki Hotta, Tohru Kamitamari | 1994-03-15 |
| 5266103 | Bath and method for the electroless plating of tin and tin-lead alloy | Motonobu Kubo, Masayuki Kiso, Teruyuki Hotta, Tohru Kamitamari | 1993-11-30 |
| 5248527 | Process for electroless plating tin, lead or tin-lead alloy | Motonobu Kubo, Masayuki Kiso, Teruyuki Hotta, Tohru Kamitamari | 1993-09-28 |
| 5234572 | Metal ion replenishment to plating bath | Motonobu Kubo, Masayuki Kiso, Teruyuki Hotta, Tohru Kamitamari | 1993-08-10 |
| 4746412 | Iron-phosphorus electroplating bath and electroplating method using same | Yosiomi Aoyagi, Tsuyoshi Uotani, Yoshio Takagi, Shinji Kato, Hitoshi Ozawa | 1988-05-24 |