Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Tian-An Chen, Jason Zhang, Katrina Certeza | 2007-05-15 |
| 7179684 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Lejun Wang, Tian-An Chen | 2007-02-20 |
| 7176422 | Chip bonding heater with differential heat transfer | — | 2007-02-13 |
| 7145120 | Guided heating apparatus and method for using the same | Bob Sankman | 2006-12-05 |
| 6940053 | Chip bonding heater with differential heat transfer | — | 2005-09-06 |
| 6902954 | Temperature sustaining flip chip assembly process | — | 2005-06-07 |
| 6899960 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Lejun Wang, Tian-An Chen | 2005-05-31 |
| 6794761 | No-flow underfill material | Tian-An Chen | 2004-09-21 |
| 6794623 | Guided heating apparatus and method for using the same | Bob Sankman | 2004-09-21 |
| 6746896 | Process and material for low-cost flip-chip solder interconnect structures | Ching-Ping Wong | 2004-06-08 |
| 6730542 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Tian-An Chen | 2004-05-04 |
| 6727594 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Tian-An Chen | 2004-04-27 |
| 6703299 | Underfill process for flip-chip device | Milan Djukic | 2004-03-09 |
| 6180696 | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant | Ching-Ping Wong | 2001-01-30 |