Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165877 | Methods for etching a material layer for semiconductor applications | Zhigang Wang, Jiao Yang, Heng Wang, Alfredo Granados, Jon C. Farr | 2024-12-10 |
| 10211030 | Source RF power split inner coil to improve BCD and etch depth performance | Rongping Wang, Jon C. Farr, Chethan Mangalore, Peter DEMONTE, Parthiban Balakrishna | 2019-02-19 |