Issued Patents All Time
Showing 151–161 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905914 | Wafer level package and fabrication method | Sukianto Rusli, David Razu | 2005-06-14 |
| 6831371 | Integrated circuit substrate having embedded wire conductors and method therefor | Sukianto Rusli | 2004-12-14 |
| 6784376 | Solderable injection-molded integrated circuit substrate and method therefor | Sukianto Rusli | 2004-08-31 |
| 6747352 | Integrated circuit having multiple power/ground connections to a single external terminal | David Jon Hiner, Sukianto Rusli | 2004-06-08 |
| 6660559 | Method of making a chip carrier package using laser ablation | Richard P. Sheridan | 2003-12-09 |
| 6534391 | Semiconductor package having substrate with laser-formed aperture through solder mask layer | Sukianto Rusli | 2003-03-18 |
| 6507102 | Printed circuit board with integral heat sink for semiconductor package | Frank J. Juskey, John R. McMillan | 2003-01-14 |
| 6448509 | Printed circuit board with heat spreader and method of making | — | 2002-09-10 |
| 6407458 | Moisture-resistant integrated circuit chip package and method | — | 2002-06-18 |
| 6372540 | Moisture-resistant integrated circuit chip package and method | — | 2002-04-16 |
| 6337228 | Low-cost printed circuit board with integral heat sink for semiconductor package | Frank J. Juskey, John R. McMillan | 2002-01-08 |