Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7427557 | Methods of forming bumps using barrier layers as etch masks | J. Daniel Mis | 2008-09-23 |
| 7297631 | Methods of forming electronic structures including conductive shunt layers and related structures | Krishna K. Nair, William E. Batchelor | 2007-11-20 |
| 7213740 | Optical structures including liquid bumps and related methods | — | 2007-05-08 |
| 7156284 | Low temperature methods of bonding components and related structures | Krishna K. Nair | 2007-01-02 |
| 7049216 | Methods of providing solder structures for out plane connections | — | 2006-05-23 |
| 7032806 | Methods of positioning components using liquid prime movers and related structures | — | 2006-04-25 |
| 6960828 | Electronic structures including conductive shunt layers | Krishna K. Nair, William E. Batchelor | 2005-11-01 |
| 6863209 | Low temperature methods of bonding components | Krishna K. Nair | 2005-03-08 |
| 6793792 | Electroplating methods including maintaining a determined electroplating voltage and related systems | Curtis Grant Jones, William Boyd Rogers | 2004-09-21 |
| 6666368 | Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween | — | 2003-12-23 |
| 6492197 | Trilayer/bilayer solder bumps and fabrication methods therefor | — | 2002-12-10 |
| 6418033 | Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles | — | 2002-07-09 |
| 6389691 | Methods for forming integrated redistribution routing conductors and solder bumps | Joseph Daniel Mis | 2002-05-21 |
| 6392163 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps | Paul A. Magill | 2002-05-21 |
| 6388203 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby | Paul A. Magill | 2002-05-14 |
| 6329608 | Key-shaped solder bumps and under bump metallurgy | Joseph Daniel Mis | 2001-12-11 |
| 6233088 | Methods for modulating a radiation signal | Mark W. Roberson, Philip A. Deane, Karen W. Markus | 2001-05-15 |
| 6137623 | Modulatable reflectors and methods for using same | Mark W. Roberson, Philip A. Deane, Karen W. Markus | 2000-10-24 |
| 6117299 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates | Christine Lizzul | 2000-09-12 |
| 6013381 | Fluorinated fluxless soldering | Stephen M. Bobbio | 2000-01-11 |
| 5990472 | Microelectronic radiation detectors for detecting and emitting radiation signals | — | 1999-11-23 |
| 5963793 | Microelectronic packaging using arched solder columns | Philip A. Deane | 1999-10-05 |
| 5892179 | Solder bumps and structures for integrated redistribution routing conductors | Joseph Daniel Mis | 1999-04-06 |
| 5793116 | Microelectronic packaging using arched solder columns | Philip A. Deane | 1998-08-11 |
| 5615825 | Fluorinated fluxless soldering | Stephen M. Bobbio | 1997-04-01 |