Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121187 | Generate a video of an item | — | 2018-11-06 |
| 8294269 | Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers | Glenn Rinne, William E. Batchelor | 2012-10-23 |
| 7879715 | Methods of forming electronic structures including conductive shunt layers and related structures | Glenn Rinne, William E. Batchelor | 2011-02-01 |
| 7297631 | Methods of forming electronic structures including conductive shunt layers and related structures | Glenn Rinne, William E. Batchelor | 2007-11-20 |
| 7156284 | Low temperature methods of bonding components and related structures | Glenn Rinne | 2007-01-02 |
| 6960828 | Electronic structures including conductive shunt layers | Glenn Rinne, William E. Batchelor | 2005-11-01 |
| 6863209 | Low temperature methods of bonding components | Glenn Rinne | 2005-03-08 |
| 4386116 | Process for making multilayer integrated circuit substrate | Keith A. Snyder | 1983-05-31 |