Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5447264 | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Nicholas G. Koopman, Iwona Turlik | 1995-09-05 |
| 5412537 | Electrical connector including variably spaced connector contacts | Paul A. Magill, Nicholas G. Koopman | 1995-05-02 |
| 5381946 | Method of forming differing volume solder bumps | Nicholas G. Koopman, Iwona Turlik, Edward K. Yung | 1995-01-17 |
| 5374893 | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Nicholas G. Koopman, Iwona Turlik, Edward K. Yung | 1994-12-20 |
| 5315485 | Variable size capture pads for multilayer ceramic substrates and connectors therefor | Paul A. Magill, Nicholas G. Koopman | 1994-05-24 |
| 5289631 | Method for testing, burn-in, and/or programming of integrated circuit chips | Nicholas G. Koopman, Iwona Turlik, Edward K. Yung | 1994-03-01 |