Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6389691 | Methods for forming integrated redistribution routing conductors and solder bumps | Glenn Rinne | 2002-05-21 |
| 6329608 | Key-shaped solder bumps and under bump metallurgy | Glenn Rinne | 2001-12-11 |
| 6222279 | Solder bump fabrication methods and structures including a titanium barrier layer | Gretchen Adema, Mark D. Kellam, W. Boyd Rogers | 2001-04-24 |
| 5902686 | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures | — | 1999-05-11 |
| 5892179 | Solder bumps and structures for integrated redistribution routing conductors | Glenn Rinne | 1999-04-06 |
| 5767010 | Solder bump fabrication methods and structure including a titanium barrier layer | Gretchen Adema, Mark D. Kellam, W. Boyd Rogers | 1998-06-16 |