Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures

Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures

US Patent 5902686 · Granted May 11, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for forming integrated redistribution routing conductors and solder bump2002
Key-shaped solder bumps and under bump metallurgy2001
Solder bump fabrication methods and structures including a titanium barrier laye2001
Solder bumps and structures for integrated redistribution routing conductors1999
Solder bump fabrication methods and structure including a titanium barrier layer1998