Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6222279 | Solder bump fabrication methods and structures including a titanium barrier layer | Joseph Daniel Mis, Gretchen Adema, Mark D. Kellam | 2001-04-24 |
| 5767010 | Solder bump fabrication methods and structure including a titanium barrier layer | Joseph Daniel Mis, Gretchen Adema, Mark D. Kellam | 1998-06-16 |