Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6117299 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates | Glenn Rinne | 2000-09-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6117299 | Methods of electroplating solder bumps of uniform height on integrated circuit substrates | Glenn Rinne | 2000-09-12 |