ML

Meng-Chang Liu

AC American Power Conversion: 11 patents #11 of 274Top 5%
TSMC: 7 patents #3,492 of 12,232Top 30%
ME Mediatek: 3 patents #879 of 2,888Top 35%
SI Schneider Electric It: 2 patents #119 of 414Top 30%
VS Vanguard International Semiconductor: 2 patents #238 of 585Top 45%
HU Hisense Usa: 2 patents #173 of 316Top 55%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
📍 New Taipei, TW: #302 of 10,472 inventorsTop 3%
Overall (All Time): #112,994 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 26–32 of 32 patents

Patent #TitleCo-InventorsDate
6485654 Method of fabricating self-aligned contacts Shea-Jue Wang 2002-11-26
6420248 Double gate oxide layer method of manufacture Shea-Jue Wang 2002-07-16
6358831 Method for forming a top interconnection level and bonding pads on an integrated circuit chip Yuan-Lung Liu 2002-03-19
6284642 Integrated method of damascene and borderless via process Chao-Bao Cheng, Kuo-Chin Hsu 2001-09-04
6040223 Method for making improved polysilicon FET gate electrodes having composite sidewall spacers using a trapezoidal-shaped insulating layer for more reliable integrated circuits Jyh-Feng Lin, Ming-Shu Yen, Su-Ying Su, Fu-Ying Chiu, Chien-Hung Lin 2000-03-21
6015751 Self-aligned connection to underlayer metal lines through unlanded via holes 2000-01-18
5801094 Dual damascene process Tri-Rung Yew, Water Lur, Shih-Wei Sun 1998-09-01