Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391664 | Selectively activatable solar cells for integrated circuit analysis | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2002-05-21 |
| 6387715 | Integrated circuit defect detection via laser heat and IR thermography | Brennan V. Davis, Rama R. Goruganthu, Michael R. Bruce, Rosalinda M. Ring | 2002-05-14 |
| 6388334 | System and method for circuit rebuilding via backside access | — | 2002-05-14 |
| 6372529 | Forming elongated probe points useful in testing semiconductor devices | Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis, Michael R. Bruce | 2002-04-16 |
| 6355564 | Selective back side reactive ion etch | Matthew Thayer | 2002-03-12 |
| 6352871 | Probe grid for integrated circuit excitation | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring, Glen Gilfeather | 2002-03-05 |
| 6350624 | Substrate removal as a functional of sonic analysis | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2002-02-26 |
| 6303396 | Substrate removal as a function of resistance at the back side of a semiconductor device | Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis, Michael R. Bruce | 2001-10-16 |
| 6300148 | Semiconductor structure with a backside protective layer and backside probes and a method for constructing the structure | Victoria J. Bruce, Amy Elizabeth Lane | 2001-10-09 |
| 6300145 | Ion implantation and laser anneal to create n-doped structures in silicon | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-10-09 |
| 6294395 | Back side reactive ion etch | Matthew Thayer | 2001-09-25 |
| 6281028 | LED alignment points for semiconductor die | Michael R. Bruce, Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis | 2001-08-28 |
| 6281025 | Substrate removal as a function of SIMS analysis | Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis, Michael R. Bruce | 2001-08-28 |
| 6281029 | Probe points for heat dissipation during testing of flip chip IC | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-28 |
| 6277659 | Substrate removal using thermal analysis | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-21 |
| 6277656 | Substrate removal as a function of acoustic analysis | Rama R. Goruganthu, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-21 |
| 6255124 | Test arrangement and method for thinned flip chip IC | — | 2001-07-03 |
| 6248600 | Led in substrate with back side monitoring | Michael R. Bruce, Rosalinda M. Ring, Rama R. Goruganthu, Brennan V. Davis | 2001-06-19 |
| 6210981 | Method for etching a flip chip using secondary particle emissions to detect the etch end-point | Victoria J. Bruce | 2001-04-03 |