DN

Deepak Nayak

AM AMD: 22 patents #477 of 9,279Top 6%
Globalfoundries: 19 patents #170 of 4,424Top 4%
ST Seagate Technology: 5 patents #1,086 of 4,626Top 25%
NO Nokia Solutions And Networks Oy: 5 patents #219 of 1,934Top 15%
AM Amazon: 3 patents #5,147 of 19,158Top 30%
MC Mcnc: 2 patents #30 of 66Top 50%
IBM: 1 patents #44,794 of 70,183Top 65%
Nortel Networks Limited: 1 patents #2,518 of 5,294Top 50%
OR Orange: 1 patents #430 of 1,023Top 45%
YA Yahoo Assets: 1 patents #261 of 538Top 50%
📍 Fremont, CA: #185 of 9,298 inventorsTop 2%
🗺 California: #5,977 of 386,348 inventorsTop 2%
Overall (All Time): #40,260 of 4,157,543Top 1%
59
Patents All Time

Issued Patents All Time

Showing 51–59 of 59 patents

Patent #TitleCo-InventorsDate
6051460 Preventing boron penetration through thin gate oxide of P-channel devices by doping polygate with silicon Ming-Yin Hao 2000-04-18
5973370 Preventing boron penetration through thin gate oxide of P-channel devices in advanced CMOS technology Ming-Yin Hao 1999-10-26
5920104 Reducing reverse short-channel effect with light dose of P with high dose of as in n-channel LDD Felicia Heiler, Rajat Rakkhit 1999-07-06
5824586 Method of manufacturing a raised source/drain MOSFET Donald L. Wollesen 1998-10-20
5817536 Method to optimize p-channel CMOS ICs using Q.sub.bd as a monitor of boron penetration Ming-Yin Hao, Rajat Rakkhit 1998-10-06
5757204 "Method and circuit for detecting boron (""B"") in a semiconductor device using threshold voltage (""V"") fluence test" Ming-Yin Hao, Rajat Rakkhit 1998-05-26
5617991 Method for electrically conductive metal-to-metal bonding Shekhar Pramanick 1997-04-08
5325265 High performance integrated circuit chip package Iwona Turlik, Arnold Reisman, Lih-Tyng Hwang, Giora Dishon, Scott Jacobs +2 more 1994-06-28
5009360 Metal-to-metal bonding method and resulting structure Arnold Reisman, Iwona Turlik 1991-04-23