Issued Patents All Time
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645780 | Method and apparatus for combining integrated and offline metrology for process control | Thomas J. Sonderman | 2003-11-11 |
| 6632692 | Automated method of controlling critical dimensions of features by controlling stepper exposure dose, and system for accomplishing same | Joyce S. Oey Hewett, Anthony J. Toprac | 2003-10-14 |
| 6615098 | Method and apparatus for controlling a tool using a baseline control script | Christopher A. Bode, Anthony J. Toprac, Joyce S. Oey Hewett, Anastasia Oshelski Peterson, Thomas J. Sonderman +1 more | 2003-09-02 |
| 6610550 | Method and apparatus for correlating error model with defect data | Christopher A. Bode | 2003-08-26 |
| 6605479 | Method of using damaged areas of a wafer for process qualifications and experiments, and system for accomplishing same | Christopher A. Bode | 2003-08-12 |
| 6589875 | Method of selectively processing wafer edge regions to increase wafer uniformity, and system for accomplishing same | Christopher A. Bode | 2003-07-08 |
| 6588007 | Use of endpoint system to match individual processing stations within a tool | Joyce S. Oey Hewett | 2003-07-01 |
| 6576385 | Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness | Christopher A. Bode, Joyce S. Oey Hewett | 2003-06-10 |
| 6540591 | Method and apparatus for post-polish thickness and uniformity control | Christopher H. Raeder, Anthony J. Toprac | 2003-04-01 |
| 6534328 | Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same | Joyce S. Oey Hewett | 2003-03-18 |
| 6444481 | Method and apparatus for controlling a plating process | Thomas J. Sonderman | 2002-09-03 |
| 6442496 | Method and apparatus for dynamic sampling of a production line | Anthony J. Toprac | 2002-08-27 |