Issued Patents All Time
Showing 101–124 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8361903 | Method and apparatus for ultra thin wafer backside processing | Ming Sun | 2013-01-29 |
| 8294254 | Chip scale surface mounted semiconductor device package and process of manufacture | — | 2012-10-23 |
| 8242013 | Virtually substrate-less composite power semiconductor device and method | Yueh-Se Ho | 2012-08-14 |
| 8222078 | Chip scale surface mounted semiconductor device package and process of manufacture | — | 2012-07-17 |
| 8217748 | Compact inductive power electronics package | Xiaotian Zhang, Francois Hebert, Ming Sun | 2012-07-10 |
| 8058727 | Standing chip scale package | Anup Bhalla, Yueh-Se Ho | 2011-11-15 |
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Xiaotian Zhang, Jun Lu | 2011-11-15 |
| 8053891 | Standing chip scale package | Anup Bhalla, Yueh-Se Ho | 2011-11-08 |
| 8048775 | Process of forming ultra thin wafers having an edge support ring | Sung-Shan Tai | 2011-11-01 |
| 7977740 | Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling | Francois Hebert | 2011-07-12 |
| 7971340 | Planar grooved power inductor structure and method | Francois Hebert, Jun Lu | 2011-07-05 |
| 7955893 | Wafer level chip scale package and process of manufacture | Francois Hebert, Ming Sun, Yueh-Se Ho | 2011-06-07 |
| 7948346 | Planar grooved power inductor structure and method | Francois Hebert, Jun Lu | 2011-05-24 |
| 7884452 | Semiconductor power device package having a lead frame-based integrated inductor | Xiaotian Zhang, Francois Hebert | 2011-02-08 |
| 7884696 | Lead frame-based discrete power inductor | Francois Hebert, Xiaotian Zhang, Jun Lu | 2011-02-08 |
| 7868431 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Xiaotian Zhang, Francois Hebert, Ming Sun | 2011-01-11 |
| 7842543 | Wafer level chip scale package and method of laser marking the same | Ruisheng Wu, Yan Liu | 2010-11-30 |
| 7811904 | Method of fabricating a semiconductor device employing electroless plating | Ming Sun, Yueh-Se Ho, Kai Liu | 2010-10-12 |
| 7776746 | Method and apparatus for ultra thin wafer backside processing | Ming Sun | 2010-08-17 |
| 7670908 | Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling | Francois Hebert | 2010-03-02 |
| 7373618 | Method and system for selection and replacement of subcircuits in equivalence checking | Kei-Yong Khoo, Debjyoti Paul, Chih-Chang Lin | 2008-05-13 |
| 6123432 | Adjustable mounting assembly for mounting a fluorescent lighting device | — | 2000-09-26 |
| 6075329 | Speed control device for a ceiling fan | Yin-Sheng Liao | 2000-06-13 |
| 5898584 | Circuit for supplying power to ceiling fan | — | 1999-04-27 |