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William A. Wojtczak

AC Advanced Technology & Materials Co.: 24 patents #14 of 410Top 4%
FU Fujifilm Electronic Materials U.S.A.: 21 patents #2 of 77Top 3%
FU Fujifilm: 2 patents #2,431 of 4,519Top 55%
SA Sachem: 2 patents #11 of 39Top 30%
🗺 Texas: #1,834 of 125,132 inventorsTop 2%
Overall (All Time): #58,266 of 4,157,543Top 2%
48
Patents All Time

Issued Patents All Time

Showing 26–48 of 48 patents

Patent #TitleCo-InventorsDate
7605113 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Ma. Fatima Seijo, David Bernhard, Long Nguyen 2009-10-20
7534752 Post plasma ashing wafer cleaning formulation Daniel Fine, Ma. Fatima Seijo, Thomas Kloffenstein 2009-05-19
7192910 Cleaning solutions and etchants and methods for using same Dean Dewulf, Sian Collins 2007-03-20
7029373 Chemical mechanical polishing compositions for metal and associated materials and method of using same Ying Ma, Cary Regulski, Thomas H. Baum, David Bernhard, Deepak Verma 2006-04-18
6967169 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Ma. Fatima Seijo, David Bernhard, Long Nguyen 2005-11-22
6936542 Polishing slurries for copper and associated materials Thomas H. Baum, Long Nguyen, Cary Regulski 2005-08-30
6896826 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Ma. Fatima Seijo, David Bernhard, Long Nguyen 2005-05-24
6875733 Ammonium borate containing compositions for stripping residues from semiconductor substrates George Guan 2005-04-05
6773873 pH buffered compositions useful for cleaning residue from semiconductor substrates Ma. Fatima Seijo, David Bernhard, Thomas H. Baum, David W. Minsek 2004-08-10
6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Ma. Fatima Seijo, David Bernhard, Long Nguyen 2004-06-29
6692546 Chemical mechanical polishing compositions for metal and associated materials and method of using same Ying Ma, Cary Regulski, Thomas H. Baum, David Bernhard, Deepak Verma 2004-02-17
6660700 Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures Ma. Fatima Seijo, David Bernhard, Long Nguyen 2003-12-09
6599870 Boric acid containing compositions for stripping residues from semiconductor substrates George Guan, Long Nguyen 2003-07-29
6566315 Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures Ma. Fatima Seijo, Dave Bernhard, Long Nguyen 2003-05-20
6527819 Polishing slurries for copper and associated materials Thomas H. Baum, Long Nguyen, Cary Regulski 2003-03-04
6492310 Boric acid containing compositions for stripping residues from semiconductor substrates George Guan, Long Nguyen 2002-12-10
6409781 Polishing slurries for copper and associated materials Thomas H. Baum, Long Nguyen, Cary Regulski 2002-06-25
6383410 Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent Long Nguyen, Stephen A. Fine 2002-05-07
6344432 Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures Ma. Fatima Seijo, David Bernhard, Long Nguyen 2002-02-05
6306807 Boric acid containing compositions for stripping residues from semiconductor substrates George Guan, Long Nguyen 2001-10-23
6280651 Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent Long Nguyen, Stephen A. Fine 2001-08-28
6224785 Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates George Guan, Daniel Fine, Stephen A. Fine 2001-05-01
6211126 Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates George Guan, Stephen A. Fine 2001-04-03