Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8005460 | Group authentication method | Jui-Tang Wang, Chien-Chao Tseng | 2011-08-23 |
| 7915128 | High voltage semiconductor devices | Fu-Hsin Chen, Ming-Ren Tsai, William Wei-Yuan Tien | 2011-03-29 |
| 7888216 | Method of fabricating a high performance power MOS | Fu-Hsin Chen, Tsung-Yi Huang, Yt Tsai | 2011-02-15 |
| 7879673 | Patterning nanocrystal layers | Jae Gon Lee, Vincent Ho, Bangun Indajang | 2011-02-01 |
| 7723785 | High performance power MOS structure | Fu-Hsin Chen, Tsung-Yi Huang, Yt Tsai | 2010-05-25 |
| 7682594 | Method for producing photocatalyst | Yueh-Fang Chen, Hsin-Yu Lin | 2010-03-23 |
| D603654 | Food container with shallow lid | Craig R. Snedden, Gandhi B. Sifuentes | 2009-11-10 |
| D603223 | Food container with deep lid | Craig R. Snedden, Gandhi B. Sifuentes | 2009-11-03 |
| D601858 | Food container | Craig R. Snedden, Gandhi B. Sifuentes | 2009-10-13 |
| D595573 | Deep lid for food container | Craig R. Snedden, Gandhi B. Sifuentes | 2009-07-07 |
| D595572 | Shallow lid for food container | Craig R. Snedden, Gandhi B. Sifuentes | 2009-07-07 |
| 7381844 | Hydrogenation process of chlorinated nitrobenzene | Yu Liu, Chung-Yin Huang | 2008-06-03 |
| 7256066 | Flip chip packaging process | Jian-Cheng Chen, Sheng-Yu Wu | 2007-08-14 |
| 7163840 | Flip chip package and manufacturing method thereof | Chih-Ming Chung, Chi-Hao Chiu | 2007-01-16 |
| 7122893 | Semiconductor package structure | Gwo-Liang Weng, Ching-Hui Chang, Yung-Li Lu | 2006-10-17 |
| 7081706 | Plasma display panel and method of forming the same | Wen-Rung Huang, Ching-Chung Cheng, Yuan-Chi Lin | 2006-07-25 |
| 7019407 | Flip chip package structure | Ming-Lun Ho, Shih-Chang Lee, Chih-Huang Chang | 2006-03-28 |
| 7002246 | Chip package structure with dual heat sinks | Ming-Lun Ho | 2006-02-21 |
| 6929980 | Manufacturing method of flip chip package | Chi-Hao Chiu, Chi-Ta Chuang, Chi-Sheng Chao | 2005-08-16 |
| 6825567 | Face-to-face multi-chip flip-chip package | Meng-Jen Wang | 2004-11-30 |
| 6521481 | Method for controlling adhesive distribution in a flip-chip semiconductor product | Hui-Lung Chou, Wann-Lung Chien | 2003-02-18 |
| 6060423 | Group VIII metal catalyst on a gallium-zinc oxide support | Sung-Cheng Hu | 2000-05-09 |
| 5585458 | Method for preparing hydroxy group end-capped polyether glycols | Wen-Fa Lin, Jih-Chen Huang, Hsueh-Ying Chen | 1996-12-17 |
| 5421737 | Universal ejector mechanism for an IC card connector apparatus | Liu Chen, Nai-Kei Wong | 1995-06-06 |
| 5415573 | Edge mounted circuit board electrical connector | Nai-Kei Wong | 1995-05-16 |