Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400990 | Semiconductor package | Sechul Park, Heewon KIM, Jongho Park, Hyojin Yun, Juil Choi | 2025-08-26 |
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Jaekyung Yoo, Chungsun Lee | 2025-08-19 |
| 12355004 | Semiconductor chip and semiconductor package | Junyeong Heo, Yeongkwon Ko, Teakhoon Lee | 2025-07-08 |
| 12218102 | Semiconductor package | Youngkun JEE, Sanghoon Lee, Chungsun Lee | 2025-02-04 |
| 12218086 | Semiconductor package and method of manufacturing same | Yongbum Kwon | 2025-02-04 |
| 12218096 | Semiconductor package and method of forming the same | Yeongkwon Ko, Soyeon Kwon, Yoonsung Kim, Teakhoon Lee | 2025-02-04 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Jumyong Park, Byeongchan KIM, Solji Song, Chungsun Lee | 2025-01-14 |