Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406888 | Semiconductor substrate and method of dicing the same | Donghoon Won, Jaeeun Lee, Junyeong Heo | 2025-09-02 |
| 12362328 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2025-07-15 |
| 12355004 | Semiconductor chip and semiconductor package | Junyeong Heo, Unbyoung Kang, Teakhoon Lee | 2025-07-08 |
| 12237240 | Semiconductor package and method of manufacturing semiconductor package | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2025-02-25 |
| 12218096 | Semiconductor package and method of forming the same | Unbyoung Kang, Soyeon Kwon, Yoonsung Kim, Teakhoon Lee | 2025-02-04 |