Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406888 | Semiconductor substrate and method of dicing the same | Donghoon Won, Jaeeun Lee, Yeongkwon Ko | 2025-09-02 |
| 12355004 | Semiconductor chip and semiconductor package | Yeongkwon Ko, Unbyoung Kang, Teakhoon Lee | 2025-07-08 |