Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Unbyoung Kang, Chungsun Lee | 2025-08-19 |
| 12362328 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2025-07-15 |