Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Jaekyung Yoo, Unbyoung Kang | 2025-08-19 |
| 12381151 | Semiconductor device and semiconductor package including the same | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Dongjoon Oh, Hyunsu Hwang | 2025-08-05 |
| 12368093 | Semiconductor packages | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin +1 more | 2025-07-22 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Solji Song, Dongjoon Oh | 2025-02-11 |
| 12218102 | Semiconductor package | Youngkun JEE, Unbyoung Kang, Sanghoon Lee | 2025-02-04 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Jumyong Park, Unbyoung Kang, Byeongchan KIM, Solji Song | 2025-01-14 |