Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412824 | Semiconductor packages and methods of forming the same | Yeongbeom Ko, Wooju Kim, Heejae Nam, Haemin Park, Junggeun Shin | 2025-09-09 |
| 12347760 | Interconnection structure and semiconductor package including the same | Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2025-07-01 |
| 12224256 | Wafer structure and semiconductor device | Hyunsu Hwang, Jumyong Park, Solji Song, Dongjoon Oh, Chungsun Lee | 2025-02-11 |