Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Jaekyung Yoo, Unbyoung Kang, Chungsun Lee | 2025-08-19 |
MK
Myungsung Kang
Overall (2025): #271,214 of 469,880Top 60%
1
Patents 2025